Application

Electronics & Precision Converting

SMT, FPC/FCCL, coating, slitting and die-cutting.

See the material stack

PI film can enter coating, laminating and precision-converting routes for flexible electronic constructions.

Material positionAs a film base, coverlay-related layer or converted insulation feature within the agreed construction.

What it addressesSupport the layer relationship and downstream converting route defined for the application.

Related productPolyimide Film

[CORRECT IMAGE REQUIRED] Confirmed FPC process and exploded-layer images are still required.View application details

Protective layer

Conductive layer

PI film position

Process carrier or substrate

Selection focus

Define the conditions before the material.

Cleanliness, flatness, surface condition, residue and dimensional fit.

These are material-selection directions, not universal system approvals. Confirm the grade, construction and actual process before use.

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